Ideally suited for precision material processing in manufacturing, R&D, research, and prototyping, the ULTRA R5000 features modular architecture, for customizable solutions and easy reconfiguration with a wide array of options. The ULTRA R5000 platform offers laser material processing for a wide range of materials. It is designed and ideally suited for material processing in manufacturing, research and development, academic research, and prototyping environments. With its unique modular architecture, customizable solutions can be easily reconfigured with a wide array of options for enhancing performance, capability, and safety to complete the perfect solution to meet present and future business needs. The ULTRA R5000 platform has a materials processing envelope of 32 x 24 in (813 x 610), with support for materials with a thickness up to 12 in (305 mm). Configure the customizable ULTRA R5000 platform with up to two laser sources consisting of two interchangeable CO2 lasers or one CO2 laser and one fiber laser. When the platform is configured with two lasers users can take advantage of MultiWave Hybrid technologyª enabling up to two of three wavelengths from 9.3 µm, 10.6 µm, and 1.06 µm Ð to be simultaneously combined into a single coaxial beam. Each spectral component of the beam is independently controlled and can be modulated in real time. Major features and options include multiple laser support, rapid laser beam positioning, precision material-independent autofocus, controllable laser power density, automation interface, multi-camera vision & registration, over temperature detection, and support for fire suppression.
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